HAADF STEM Image of Copper Aluminum Precipitates
A high angle annular dark field scanning transmission electron micrograph recorded in a Dualbeam FIB of semi-coherent copper aluminum precipitates in an aluminum alloy.
Image by FEI
A high angle annular dark field scanning transmission electron micrograph recorded in a Dualbeam FIB of semi-coherent copper aluminum precipitates in an aluminum alloy.
Image by FEI
Geological section of mulitples phases with various levles of Ca within them. Image recorded in Ca K Alpha line.
Image by Bob Anderhalt
SEM image of porous silicon.
Image by EMAL Staff
Convergent beam electron diffraction pattern of M23X6, a metal carbo-nitro-boride common in steels.
Pattern by John Mansfield
TEM image of soot particles on a holey carbon support film.
Image by EMAL Staff
An XEDS map of a semiconductor chip, green is the silicon K alpha line, yellow is the gols M alpha line and red the carbon K line.
Image by John Mansfield
A high angle annular dark field scanning transmission electron micrograph recorded in a Dualbeam FIB of semi-coherent copper aluminum precipitates in an aluminum alloy.
Image by FEI
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EMAL Committee Member & Associate Professor Address: |
E-mail: panx@engin.umich.edu
Phone: (734) 647-6822
Fax: (734) 763 4788
Homepage: http://msewww.engin.umich.edu/research/groups/pan/
Research Interests:
Current research involves the structure/property relationships in both functional and structural ceramics. High Resolution Transmission Electron Microscopy (HRTEM), in combination with Analytical Electron Microscopy (AEM), are utilized to study the bulk ceramics and/or thin films of chemical sensors, ferroelectrics, and silicon nitride-based materials. Physical and chemical deposition techniques are used to prepare the films. Problems under investigation include interfacial structure and chemistry, grain growth, defects, segregation behavior, and electrical properties. Considerable emphasis is placed on understanding the atomistic structure and chemistry of ceramic/ceramic and metal/ceramic interfaces.