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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

Dr. Anja Schleicher

Anja Schleicher

Assistant Research Scientist
TEM Trainer (Central Campus)

Address:
Central Campus Electron Microbeam Analysis Laboratory
Department of Earth and Environmental Sciences,
R.B. Mitchell Laboratory
2509 C.C. Little Building
University of Michigan
Ann Arbor, MI 48109-1005

E-mail: aschleic@umich.edu
Phone: (734) 615-6657

Contact me for:
TEM, XRD and X-ray texture goniometer (XTG) and specimen preparation equipment
Training and problems in Central Campus EMAL.

Schedule
I am in EMAL in the mornings, Monday through Friday.

How to get training on the central campus XRD systems
E-mail me or call me to set up a training session

For more about me see here and my home page.