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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

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