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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

EMAL Videos

This EMAL Videos section contains a series of presentations that were recorded with the College of Engineering's Lecture Capture System. This system records not only the slides presented to the audience, but also syncs them with audio and video of the presenter. This system was developed in the College of Engineering in 2005 by Phil Treib, the Computer Aided Engineering Network's director of instructional technology (see here). EMAL presentations will typically be recorded and made available on this section of the EMAL Web Site.